These are much more expensive because they can't be manufactured just by drilling a hole through the whole board, more steps are needed, and these are special order, which means $$$. Your Altium stackup also mentions blind vias, which only connect 2 layers so they leave more space on the other layers. It will link all the layers where you connect a track to the via, and it will also connect to power/ground planes based on net names. When you use a standard thru via, it goes through all the layers. How can I send signals to the middle 2 layers in a 4 stack without the use of vias? Reply to layers is overkill, but these days it is pretty cheap and it saves time, so no problem with that. On the top layer, I have SPI communication lines (20mils).Within the bottom layer, I have +5V signal traces (25mils) and sensor signal traces (20mils).Entire bottom layer is a GND plane (polygon pour) that combines analog GND and digital GND (GND traces are 20mils).( Photodiode -> Transimpedance Op Amp -> 13-Bit ADC ) -> Arduino Micro -> PC Are there any evident improvements I can make to the schematic to improve the noise performance?.Are there any evident errors with the PCB layout?.This PCB is to be mounted on top of the Arduino Micro via the 17-pin headers, and will interface with the ADC using SPI protocol. My custom PCB consists of a photodiode, transimpedance op amp, 13-bit ADC, and bypass capacitors. I am very new to PCB design and have recently completed schematic capture and PCB layout of an optical detection circuit using Altium Designer.
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